These values represent the maximum and minimum normal strain acting on that specific point of the board. Strain Rate ( ϵ̇epsilon dot
: Full-color photographs and diagrams were added to clarify gauge placement and board instrumentation
In modern electronics manufacturing, the push for miniaturisation has led to thinner PCBs and denser component packaging, such as . While these advancements improve performance, they also make assemblies highly susceptible to mechanical damage from board flexure.
The tests described in IPC-9704 can be performed at multiple stages: ipc-9704 pdf
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Gages are typically bonded to the PCB surface within a few millimeters of the target component's corner pads, aligned precisely with the board's axes. 2. High-Speed Data Acquisition
Surface Mount Technology (SMT) pick-and-place machines exert downward force when mounting large components or connectors. 4. Heat Sink and Connector Assembly These values represent the maximum and minimum normal
The standard specifies exactly how to set up your strain testing to ensure accuracy: Strain Gage Selection : Recommends three-element stacked rosette gages
If you are searching for the PDF, you need to know which revision you need.
Excessive mechanical strain on a printed circuit board assembly can lead to various catastrophic failure modes. IPC-9704 addresses a critical need in the electronics industry by helping to mitigate issues such as: The tests described in IPC-9704 can be performed
The IPC-9704 standard provides several benefits to designers, manufacturers, and inspectors of high-reliability PCBs. Some of the benefits include:
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The is the electronics industry's blueprint for measuring and managing these mechanical stresses. It focuses on using strain gages to prevent component damage, particularly for strain-sensitive components like Ball Grid Arrays (BGAs). What is IPC-9704?