Eyeq4 Datasheet
: Enables Level 2, Level 3, and beyond autonomous driving features by processing sensor data to understand the environment, make decisions, and control the vehicle.
Pedestrians, cyclists, motorcyclists, and varying vehicle classes (cars, trucks, emergency vehicles). 6. Functional Safety & Cybersecurity
For automotive tier-1 suppliers and OEMs, the EyeQ4 datasheet outlines a highly stable, ISO 26262 compliant platform capable of driving multi-camera surround perception, REM mapping, and robust L2+/L3 driving automation safely into the mass market.
If you are downloading the EYEQ4 datasheet for a new project, keep these practical engineering factors in mind: eyeq4 datasheet
Key processing strengths include:
than its predecessor, the EyeQ3, while keeping power consumption remarkably low.
The is a highly efficient brain for modern cars . It is a vision processor chip made by Mobileye . It helps cars see, read road signs, and stay safe. : Enables Level 2, Level 3, and beyond
Supports up to eight cameras. This allows a typical configuration of one forward-facing trifocal camera assembly, side-view cameras, and rear-view cameras for a complete 360∘360 raised to the composed with power surround-view cocoon.
A: No. The EyeQ4 has no video encoder. Raw or minimally processed frames are sent over Ethernet.
| Parameter | Specification | | :--- | :--- | | | 28nm CMOS (FinFET) | | Maximum Camera Inputs | 8 simultaneous cameras | | Processing Performance | 2.5 TOPS (Trillion Operations Per Second) | | Power Consumption | 3W – 5W (typical thermal design power) | | Operating Temperature | -40°C to +125°C (Automotive Grade) | | Safety Certification | ASIL-B (ISO 26262) | | Package Type | BGA (Ball Grid Array) – 585 pin variant | | Interface Support | CAN-FD, FlexRay, Gigabit Ethernet, LVDS, I2C, SPI, GPIO | It is a vision processor chip made by Mobileye
A VLIW and SIMD machine optimized for computer vision and deep learning algorithms.
: Six specialized VLIW/SIMD programmable vector engines. These handle high-density, short-integral data calculations foundational to raw computer vision and pixel manipulation.
The datasheet recommends a 4-layer PCB with at least 6 thermal vias under the exposed die pad for conduction to chassis ground.